RESIDUAL-STRESS DEVELOPMENT
- Label
- RESIDUAL-STRESS DEVELOPMENT (literal)
- Membro di
- Parole chiave di "Warpage induced in bi-material specimens: Coefficient of thermal expansion, chemical shrinkage and viscoelastic modulus evolution during cure" (Insieme di parole chiave)
- Keywords of "Toward a constitutive model for cure-dependent modulus of a high temperature epoxy during the cure" (Insieme di parole chiave)
- Value
- RESIDUAL-STRESS DEVELOPMENT (literal)
Incoming links:
- Ha membro
- Parole chiave di "Warpage induced in bi-material specimens: Coefficient of thermal expansion, chemical shrinkage and viscoelastic modulus evolution during cure" (Insieme di parole chiave)
- Keywords of "Toward a constitutive model for cure-dependent modulus of a high temperature epoxy during the cure" (Insieme di parole chiave)
