Wettability of Hot-pressed Silicon Nitride Materials by Liquid Copper (Articolo in rivista)

Type

• Prodotto della ricerca (Classe)
• Articolo in rivista (Classe)

Label

• Wettability of Hot-pressed Silicon Nitride Materials by Liquid Copper (Articolo in rivista) (literal)

Anno

• 1988-01-01T00:00:00+01:00 (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#doi

• 10.1016/0025-5416(88)90518-6 (literal)

Alternative label

• Sangiorgi R., Muolo M. L., Bellosi A. (1988)
  Wettability of Hot-pressed Silicon Nitride Materials by Liquid Copper
  in Materials science and engineering (Lausanne)
  (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori

• Sangiorgi R., Muolo M. L., Bellosi A. (literal)

Pagina inizio

• 277 (literal)

Pagina fine

• 283 (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#numeroVolume

• A103 (literal)

Rivista

• Materials science and engineering (Rivista)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#numeroFascicolo

• 2 (literal)

Note

• Scopu (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#affiliazioni

• Istituto di Chimica Fisica Applicata dei Materiali, Consiglio Nazionale delle Ricerche, Lungobisagno Istria 34, 16141 Genoa, Italy (literal)

Titolo

• Wettability of Hot-pressed Silicon Nitride Materials by Liquid Copper (literal)

Abstract

• The wettability of six different types of hot-pressed silicon nitride by liquid copper was evaluated at a temperature of 1373 K by the sessile drop method. The selected materials were such as to cover a wide range of additives (Y2O3, MgO, ZrO2 and Al2O3) and hot-pressing conditions. The experimental results were related to the microstructures of the substrates, and the equilibrium contact angle values were correlated with the physicochemical characteristics of the materials and with the mechanical status of their surfaces. A mean contact angle value of 135° was found for five out of the six types, leading to a value of 380 mJ m-2 for the work of adhesion. The sixth type exhibited a contact angle value of 144° and a value of 250 mJ m-2 for the work of adhesion. The different results obtained for the various types of substrate were ascribed to the effects induced by the roughness of the substrates, whereas the different ways of producing the materials and the oxide content did not markedly affect the materials' wettability. (literal)

Prodotto di

• Institute of Condensed Matter Chemistry and Energy Technologies (ICMATE) (Istituto)
• Institute of science and technology for ceramics (ISTEC) (Istituto)
• Sistemi solido-liquido ad alte temperature e processi di giunzione (ET.P06.006.003) (Modulo)

Autore CNR

• ALIDA BELLOSI (Persona)
• MARIA LUIGIA MUOLO (Unità di personale interno)

Insieme di parole chiave

• Parole chiave di "Wettability of Hot-pressed Silicon Nitride Materials by Liquid Copper" (Insieme di parole chiave)

Incoming links:

Prodotto

• Institute of science and technology for ceramics (ISTEC) (Istituto)
• Institute of Condensed Matter Chemistry and Energy Technologies (ICMATE) (Istituto)
• Sistemi solido-liquido ad alte temperature e processi di giunzione (ET.P06.006.003) (Modulo)

Autore CNR di

• ALIDA BELLOSI (Persona)
• MARIA LUIGIA MUOLO (Unità di personale interno)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#rivistaDi

• Materials science and engineering (Rivista)

Insieme di parole chiave di

• Parole chiave di "Wettability of Hot-pressed Silicon Nitride Materials by Liquid Copper" (Insieme di parole chiave)